SC²S Colloquium - April 10, 2017
|Date:||April 10, 2017|
|Time:||3:00 pm, s.t.|
Ulrich Huber: A Scalable Mesh Format for Parallel Unstructured Meshes in Scientific Applications
A common goal of all scientific applications is an optimized workflow and good scalability. Therefore the code of such applications as well as the used file formats for initialization need to be optimized, both in time consumption as well as scalability. PXDMF, a mesh format for parallel unstructured meshes providing small file sizes, scalability and small generation and initialization times, is presented in this talk. The format is not tailored to a specific use case, but supports various topologies for cells and can handle additional data, needed by using applications. An initialized mesh is stored in the library within a traversable data structure, by which applications can access all data. Furthermore PXDMF provides all required information, enabling applications to establish a communication structure. Finally PXDMF is compatible to visualization tools, such as ParaView and VisIt and supports homogeneous as well as heterogeneous clusters. All this makes PXDMF applicable to a broad spectrum of scientific applications, using unstructured partitioned meshes, to solve their scenarios.
Eduard Kharitonov: Numerical simulation of the bonding process to perform in situ control
Wire bonding is a friction-welding process actuated by an ultrasonic oscillation which works on the wire and welds it to a substrate without going through a liquid phase. The interest is in a workable mathematical modelling of the bonding process comes from the fact that the is a limited understanding of the process details even though wire bonding is by far the most important interconnection process in semiconductor technology. The model system should use the observable parameters current, frequency and deformation to characterize the progress of a wire bond as it is being formed under different parameter combinations. This should allow a predictive description of the bond’s quality and therefore a useful approach to an automated process for optimizing bond parameters under different conditions of the wire hardness, wire diameter and other surface properties.